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E-mail: hsong@kier.re.krReceived May 27, 2014, Accepted June 20, 2014To realize copper-based electrode materials for printed electronics applications, it is necessary to improve theadhesion strength between conductive lines and the substrate. Here, we report the preparation of Cu pastesusing (3-glycidoxypropyl) trimethoxysilane (GPTMS) prepolymer as an adhesion promoter (AP). The Cupastes were screen-printed on glass and polyimide (PI) substrates and sintered at high temperatures (> 250

High-temperature Adhesion Promoter Based on (3-Glycidoxypropyl) Trimethoxysilane for Cu Paste