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It is recognized that phase diagrams and a thermodynamic database constructed by the CALPHAD (Calculation of Phase Diagrams) approach play an important role in alloy design and materials development. In this paper, recent progress on the thermodynamic database for micro-solders and Cu-base alloys, which is useful for the development of Pb-free solders and predictions of interfacial phenomena between solders and the Cu substrate in electronic packaging technology, is presented. In addition, typical examples of the application of phase diagrams are presented to facilitate the development of shape memory alloys, Co-Cr base magnetic recording media, ferromagnetic Heusler alloys and Co base superalloys.

PHASE DIAGRAMS AS TOOLS FOR ADVANCED MATERIALS DESIGN- APPLICATIONS TO NON-FERROUS ALLOYS