English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Ag paste has been used in the front electrode of the Si-solar cell. It is composed by Ag powder, glass frit, binder, solvent and dispersant. The role of the binder and the solvent is to make a flow and a printing property. However, it was not enough to report the printing properties with the variation of binder in the controled viscosity. In this study, we selected 3 kinds of typical binder which were used as binder for the paste in the industry, such as Ethyl cellulose, Hydroxypropyl cellulose and Acrylic. Ag pastes using these were prepared, controled viscosity and printed on the SiNx coated Si wafer. In the `A paste` used Acrylic binder, printed hight was highest and `H paste` used Hydroxypropyl cellulose binder was lowest. Because `H paste` was high viscosity due to the molecular weight, the solvent was added in the paste to control the viscosity. Therefore, the content of solid was lower in `H paste`. The relative pattern width which is related to the spreading of paste was the best in the case of `H paste` and `EH paste` at . It is thought that the optimization of the relative pattern width is possible for a paste by the controling shear thinning phenomenon. In the case of `A paste`, though printing hight was best, the pattern width was dependant on the temperature.

Printing Properties of Ag Paste with the Variation of Binder on the SiNxCoated Si Wafer

Printing Properties of Ag Paste with the Variation of Binder on the SiN_xCoated Si Wafer