English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The interpenetrating polymer networks (IPN) thin film with the –C=O group in one network and the terminal –N=C=O group in another network on an aluminum substrate to reinforce the adherence between IPN and aluminum through interfacial reactions, were obtained by dip-pulling the pretreated aluminum substrate into the viscous-controlled IPN precursors and by the following thinning treatment to the IPN film to a suitable thickness. The interfacial actions and the adhesion strengths of the IPN on the pretreated aluminum substrate were investigated by the X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy (FTIR) and strain-stress(?-?) measurements. The XPS and FTIR detection results indicated that the elements’ contents of N, O, and Al varied from the depths of IPN. The in-terfacial reaction occurred between the –N=C=O group of IPN and the AlO(OH) of pretreated aluminum. The in-creased force constant for –C=O double bond and the lower frequency shift of –C=O stretching vibration absorption peak both verified the formation of hydrogen bond between the –OH group in AlO(OH) and the –C=O group in IPN. The adherence detections indicated that the larger amount of –N=C=O group in the IPN, the higher shear strengths between the IPN thin film and the aluminum substrate

Interfacial Actions and Adherence of an Interpenetrating Polymer Network Thin Film on Aluminum Substrate