English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Texturing of diamond wirecut wafers using a standard wafer etch process chemistry has always been a challenge in solar cellmanufacturing industry. This is due to the change in surface morphology ofdiamond wire cut wafers and the abundant presence of amorphous silicon content,which are introduced from wafer manufacturing industry during sawing ofmulti-crystalline wafers using ultra-thin diamond wires. The industry standardtexturing process for multi-crystalline wafers cannot deliver a homogeneousetched silicon surface, thereby requiring an additive compound, which acts likea surfactant in the acidic etch bath to enhance the texturing quality ondiamond wire cut wafers. Black silicon wafers on the other hand requirecompletely a different process chemistry and are normally textured using a metalcatalyst assisted etching technique or by plasma reactive ion etchingtechnique. In this paper, various challenges associated with cell processingsteps using diamond wire cut and black silicon wafers along with cellelectrical results using each of these wafer types are discussed.

Challenges in Processing Diamond Wire Cut and Black Silicon Wafers in Large-Scale Manufacturing of High Efficiency Solar Cells