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Shigeyoshi NAKAYAMA , Miki HAYASHI , Hiroyuki FUJIOKA , Takashi SEKIYA, Takenori NOTOYA c and Toshiyuki OSAKAI d a Analysis Technology Research Center, Sumitomo Electric Industries, Ltd.(1-1-3, Shimaya, Konohana-ku, Osaka-shi, Osaka 554-0024) b Analysis Technology Research Center, Sumitomo Electric Industries, Ltd.(1-1-1, Koyakita, Itami-shi, Hyogo 664-0016) c Japan Copper and Brass Association(1-10-10, Ueno, Taitou-ku, Tokyo 110-0005) d Graduate School of Science, Kobe University(1-1, Rokkoudai-cho, Nada-ku, Kobe-shi, Hyogo 657-8501)

Chemical State Analysis of Heat-Treated Tin Plating on Pure Copper and Brass