English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

After zinc oxide (ZnO)thin films were deposited using chemical solution methods such as sol-gel method and metal organic decomposition, the deposited ZnO thin films were used as a precursor promoting adhesion in Cu/glass stack systems. Transparent ZnO thin films were deposited on a borosilicate glass substrate using chemical solution methods. X-ray diffraction and X-ray photoelectron spectroscopy analyses revealed that the deposited ZnO thin films have no specified orientation and much less carbon contamination. The obtained ZnO thin films comprised two characteristic layers: a porous structure formed at the glass substrate side and a dense layer formed at the surface side. The adhesion of Cu/glass stacks formed by the ZnO thin films increased markedly when the ZnO/glass stacks were annealed at 600 °C. Furthermore, the adhesion increased with increasing ZnO removal time, reaching a maximum value at a certain removal time, but decreasing thereafter. These results indicate that the deposited ZnO thin films are effective for the improvement of Cu/glass stack adhesion. Results show that a Zn-doped layer formed at the glass surface plays an important role in the improvement of Cu/glass stack adhesion.

Improvement in Adhesion of Cu/glass Stacks using ZnO Thin Films Deposited by Chemical Solution Methods and Its Formation Conditions