English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The effects of plating factors on the magnetic properties of electrodeposited Co-P have been investigated using a Cu substrate in chloride baths containing NaH2PO2 at 50°C under galvanostatic conditions. The coercive force (Hc), the residual magnetization (Mr), and the Mr/Ms ratio measured along in-plane (||) and perpendicular (⊥) directions to the Co-P film plane changed with variations in the NaH2PO2 concentration in the bath, organic additives, and current density. Under conditions where the c-axis of hexagonal crystals deposited was oriented perpendicular to the film plane, the Mr (⊥) and the Mr/Ms (⊥) increased, and the Mr (||) and the Mr/Ms (||) decreased. The Hc was dependent on the crystal grain size of deposited Co-P. The Hc increased with a decrease in the grain size of deposits in the range of 15 to 31nm, while the Hc decreased with a decrease in the grain size in a range no longer than 15nm. On the other hand, the Hc also tended to increase when the c-axis of hexagonal crystals deposited was oriented perpendicular to the film plane.

Effects of Plating Factors on the Magnetic Properties of Co-P Electrodeposited from Chloride Baths.