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where (L) indicates " in solution " and (s) indicates " in solder film " . Increasing the concentration of Sn 2 + and the temperature reversed the redox potentials, M 2 + +2e •¬ M, toward less noble Sn making the forward reaction dominant. This treatment produced a smooth surface lustrous and enriched in tin content in the outer portions of the film. This resulted in a marked inprovement in antioxidation properties, adhesion to the basis metal, solderability, and heat-humidity stability. Enriched lead in the bath due to the multitreatment was easily removed as PbSO4 precipitate by adding sulfric acid.

Solder Plating Surface Improved Using Tin Substitution.