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Two lead free solders were developed for die attach application. The bismuth based solder has a melt temperature of 271C and thermal conductivity of 18W/mK. The zinc based solder has a melt temperature of 337C and thermal conductivity of 85W/mK. Both solders have acceptable wetting on bare copper and nickel plated copper substrate, could be processed using modified high lead solder process condition and survived 260C board level reflow simulation. This paper discusses the solder material properties, and presents the die attach process and reliability test results in a manufacturing environment.

High Melting Temperature Lead Free Solder for Die Attach Application