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https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

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Summary: Expanding wireless application areas will continue to drive increased semiconductor demand. Consumer demand for increased features/ capability is driving mobile wireless prodcut demand - smaller, sleeker, more affordable devices. Innovative technology scaling is required to meet challenges of low cost, low power and smaller form factors. Co-design of architecture, design, silicon and packaging are required to solve issues with transition to flip chip due to: non-compliant interconnect (pb-free and Cu pillar); mechanically weak dielectrics in die; pressure to shrink package height and x,y dimensions; control co-planarity and high temperature warpage.

Migration to FC in the Wireless Application Space and Associated Challenges