English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The thermal characteristics of a flip-chip BGA package on board are numerically investigated under both natural and forced convection conditions. The possible heat transfer enhancement strategy using heat sink is also addressed. Heat generated at the junction could transfer in the upward and downward (through PCB) directions of the package, and then be dissipated to the ambient by both convection and radiation. For the cases without heat sink, the amount of the heat dissipated through the PCB comprises 90% and 75% of the power generated for the natural and forced convection regimes, respectively. With the proper heat sink attached the rate of the upward heat transfer increases and can reach 50% of the power dissipated under the forced convection condition. Detailed analysis is presented regarding the effects of the cross flow velocity, the number of fins and the height of the heat sink on the thermal resistance of the flip-chip BGA package.

Numerical Investigations Of The Thermal Characteristics Of A Flip-Chip BGA Package With And Without Heat Sink