English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

A new high-temperature die attachment system that is cost effective has been strongly desired for SiC power applications in electric vehicles and consumer electronics. This paper presents preliminary results for SiC/Zn-Al/Cu-SiN die attachments using eutectic Zn-Al solder (m.p. = 356°C), focusing on preparation and die-shear reliability. Superior wettability and reproducibility were achieved in the soldering process. It was found that the attachments were viable at least for short-term application in a temperature range up to 300°C. Reliability test results revealed that they could withstand storage for 1500 hours at 200°C and thermal cycle stress of 1500 cycles between –40°C and 200°C.

Common Metal Die Attachment for SiC Power Devices Operated in an Extended Junction Temperature Range