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A new type of multi-site magnetron sputtering system has been researched, which has more than one workbench. Based on the operating principle of the magnetron sputtering system which with a circular plane target, a mathematical model has been developed to simulate and discuss the influencing factors on the film thickness uniformity. The results showed that when the substrates were rotating axially and eccentrically, the film thickness distribution were affected by both the target-substrate distance and the eccentricity. If the eccentricity was constant, the film thickness would become thinner when the target-substrate distance increased, and the thickness uniformity tended to be improved. If the target-substrate distance was constant, the thickness uniformity would become better when the eccentricity increased. Moreover, if the substrate rotated axially and revolved around the target simultaneously, the thickness uniformity would become better when velocity ratio of axial rotation to revolution increased. And the effect of the thickness uniformity became small gradually if the ratio increases to a certain degree. In addition, increasing the etching area properly not only could conduct the film distribution to better, and improve the substrate film thickness uniformity also. Finally, taking a series of experiments, and analyzing the experimental data, the conclusion of the study results in the paper had been verified.

Research of Film Uniformity on Vacuum Coating by Magnetron Sputtering with Multi-Sites