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For processing of desired information, the present-day electronic equipment is rapidly approaching their ultimate speed and bandwidth constraints, which is an ever more serious problem that prevents their persistent use in applications. It is believed that a promising solution is to fabricate electronic and photonic elements on a single chip. This mechanism provides a larger bandwidth that is used to construct new hybrid electronic photonic devices. In this paper the numerical analysis and design of metal-insulator-metal plasmonic directional coupler are presented. In dual optical bands, this directional coupler design needed the concept of the step impedance resonators (SIRs). Without reducing the subsystems, the enhanced architectures that pertain to filtering as well as multiplexing devices are necessary for conclusion of these kinds of specifications. Photonic-integrated circuits (PICs) have effectively improved their work by present design directional coupler, and it can be mixed with the conventional silicon PICs.

A New MIM Directional Coupler With Twin Bands for Photonic ICs