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Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and 180 C for 300hrs. The AlAu phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, AuSn , and AuSn phases formed at interface between the Au stud and Sn. AuSn , AuSn /AuSn , and AuSn phases dominantly grew as the aging time increased at 120 C, 150 C, and 180 C, respectively, while (Au,Cu) Sn / Cu Sn phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at AlAu /Au, Au/Au-Sn IMC, and Cu Sn/Cu interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.

Effect of Thermal Aging on Intermetallic Compound Growth Kinetics of Au Stud Bump