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The article considers important to study the issues of removal of oxide films from the surface of metals and solder materials and the increase of homogeneity of the space in the process of soldering under the active gas and vacuum conditions. Theoretical and experimental studies have shown that the process of self-fluxing is mainly associated with the reduction of adsorption forces, dispersion of oxide films and solubility in solder.Keywords: steel unit, copper-phosphorus alloy, active gas-vacuum, melting temperature, cracking, wetting, oxide film, self-fluxing, microstructure, hardening.

INVESTIGATION OF WAYS TO REMOVE OXIDE FILM FROM THE SURFACE OF METALS AND SOLDER MATERIALS IN THE SOLDERING PROCESS UNDER DIFFERENT CONDITIONS