English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Stricter requirements for reliability of integrated circuits in ceramic-metal packages led to the increased requirements for process and quality control of the atmosphere in which circuits are being sealed. In our experiments we manage to reduce humidity in integrated circuit packages, by the constant monitoring of the sealing process atmosphere.

METHODS FOR ENSURING LOW HUMIDITY IN THE INTERNAL VOLUME OF CERAMIC-METAL CASES IN SERIES PRODUCTION OF INTEGRATED CIRCUITS