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A computational study is carried out on a rectangular microchannels heat sink using nanofluids flow for cooling of electronics device under uniform heat flux condition. In the present investigation water, ethylene glycol and a mixture of ethylene glycol (20%wt) and water are considered as base fluids with varying concentration of five different nanoparticles includingAl2O3, TiO2, CuO, SiO2 and ZnO. Numerical computations are performed using ANSYS Fluent software by considering the single phase model and results are validated with available experimental and numerical data. Further parameters like thermal resistance, pumping power, local heat transfer coefficient and temperature variation of IC chip are presented and analysed. It was noted that with addition of nanoparticles there is sharp increment in local heat transfer coefficient and decrements in local thermal resistance compared to base fluid but at same time viscosity of fluid increases that provide more drag or pressure drop which ultimately increases the pumping power. CuO-Water nanofluid of concentration 1% and 4% give large improvement in heat transfer parameters and at the same time there is little enhancement in pressure losses or pumping power also it has less cost and more stability in base fluid as compared to other nanofluids.

Effects of Nanofluid Flow in Micro channel Heat Sink for Forced Convection Cooling of Electronics Device: A Numerical Simulation