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Advancements in production techniques in PCB manufacturing industries are still required as compared to silicon-ICs fabrications. One of the concerned areas in PCBs fabrication is the use of conventional methodologies for metallization. Most of the manufacturers are still using the traditional Copper (Cu) laminates on the base substrate and patterning the structures using lithography processes. As a result, significant amounts of metallic parts are etched away during any mass production process, causing unnecessary disposables leading to pollution. In this work, a new approach for Cu metallization is demonstrated with considerable step-reducing pattern-transfer mechanism. In the fabrication steps, a seed layer of covalent bonded metallization (CBM) chemistry on top of a dielectric epoxy resin is polymerized using actinic radiation intensity of a 375 nm UV laser source. The proposed method is capable of patterning any desirable geometries using the above-mentioned surface modification followed by metallization. To metallize the patterns, a proprietary electroless bath has been used. The metallic layer grows only on the selective polymer-activated locations and thus is called selective metallization. The highlight of this production technique is its occurrence at a low temperature (20–45 °C). In this paper, FR-4 as a base substrate and polyurethane (PU) as epoxy resin were used to achieve various geometries, useful in electronics packaging. In addition, analysis of the process parameters and some challenges witnessed during the process development are also outlined. As a use case, a planar inductor is fabricated to demonstrate the application of the proposed technique.

Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging