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A novel and cost-effective method for the fabrication of highly conductive Al/Ag core-shell structured microspheres was proposed and investigated. The oxidative co-deposition of catechol and polyamine was firstly performed to modify the surface of the aluminum microsphere. Then, a two-step electroless plating was conducted to fabricate the Al/Ag microspheres. During the first step of the electroless plating process, the surface of the aluminum microsphere was deposited with silver nanoparticle seeds using n-octylamine and ethylene glycol. Then, during the second step of the electroless plating process, silver particles grew evenly to form a compact silver shell on the surface of aluminum via a silver mirror reaction. According to the scanning electron microscope and energy dispersive X-ray results, a compact and continuous silver layer was successfully generated on the surface of the aluminum. The valence of the sliver on the surface of the aluminum was confirmed to be zero, based on the X-ray photoelectron spectrometer and X-ray diffractometer analyses. As a result, the as-prepared Al/Ag microspheres exhibited a high conductivity of 10,000 S/cm. The Al/Ag/MVQ composite demonstrated low electrical resistivity of 0.0039 Ω·cm and great electromagnetic interference shielding effectiveness at more than 70 dB against the X-band, and this result suggests that the as-prepared composite is a promising conductive and electromagnetic shielding material.

Fabrication of Highly Conductive Silver-Coated Aluminum Microspheres Based on Poly(catechol/polyamine) Surface Modification