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With the development of integrated devices, the local hot spot has become a critical problem to guarantee the working efficiency and the stability. In this work, we proposed an innovative approach to deliver graphene foam/polyaniline@epoxy composites (GF/PANI@EP) with improvement in the thermal and mechanical property performance. The graphene foam was firstly modified by the grafting strategy of p-phenylenediamine to anchor reactive sites for further in-situ polymerization of PANI resulting in a conductive network. The thermal conductivity (κ) and electromagnetic interference shielding (EMI) performance of the optimized GF/PANI 4:1 @EP is significantly enhanced by 238% and 1184%, respectively, compared to that of pristine EP with superior reduced modulus and hardness. Such a method to deliver GF composites can not only solve the agglomeration problem in traditional high content filler casting process, but also provides an effective way to build up conductive network with low density for thermal management of electronic devices.

Preparation of p-Phenylenediamine Modified Graphene Foam/Polyaniline@Epoxy Composite with Superior Thermal and EMI Shielding Performance