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Silver nanowires (AgNWs) have been investigated as alternatives to indium tin oxide in transparent conductive films (TCFs) for electronics. However, AgNW TCFs still pose stability issues when exposed to thermal, chemical, and mechanical stimuli. Herein, we demonstrate a facile and effective route to improve stability by treating the films with dilute ferric chloride solution. Our results indicate that after treatment the films exhibit a dramatically enhanced stability against aging, high temperature oxidation, chemical etching, sulfurization, and mechanical straining. Size-dependent instability is fully explored and explained regarding surface atomic diffusion, which could be blocked by enhancing the activation energy of surface diffusion through forming a AgCl cap under ferric chloride solution treatment. Chemisorption-related Fermi level shift of silver nanowires is applied to tune their chemical reactivity to ferric chloride solution for balancing between size-dependent stability improvement and maintaining optoelectrical properties. Owing to the dilute treatment solution, the treated films exhibit a negligible change in light transmittance, whereas sheet resistance decreases by 30% and flexibility increases because of capillary-force-induced welding of contacting AgNWs and AgCl layer mediated tightening. These findings are significant for real-world applications of AgNW TCFs.

Tackling the Stability Issues of Silver Nanowire Transparent Conductive Films through FeCl3 Dilute Solution Treatment