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Yttrium fluoride (YF₃) and yttrium oxide (Y₂O₃) protective coatings prepared using an atmospheric plasma spraying technique were used to investigate the relationship between surface erosion behaviors and their nanoparticle generation under high-density plasma (10 12 -10 13 cm -3 ) etching. As examined by transmission electron microscopy, the Y₂O₃ and YF₃ coatings become oxyfluorinated after exposure to the plasma, wherein the yttrium oxyfluoride film formation was observed on the surface with a thickness of 5.2 and 6.8 nm, respectively. The difference in the oxyfluorination of Y₂O₃ and YF₃ coatings could be attributed to Y-F and Y-O bonding energies. X-ray photoelectron spectroscopy analyses revealed that a strongly fluorinated bonding (Y-F bond) was obtained on the etched surface of the YF₃ coating. Scanning electron microscopy and energy dispersive X-ray diffraction analysis revealed that the nanoparticles on the 12-inch wafer are composed of etchant gases and Y₂O₃. These results indicate that the YF₃ coating is a more erosion-resistant material, resulting in fewer contamination particles compared with the Y₂O₃ coating.

Comparison of Erosion Behavior and Particle Contamination in Mass-Production CF4/O2 Plasma Chambers Using Y2O3 and YF3 Protective Coatings