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In this study, single groove nanoscratch experiments using a friction force microscope (FFM) with a monocrystalline diamond tip were conducted on a c-plane sapphire wafer to analyze the ductile-regime removal and deformation mechanism including the anisotropy. Various characteristics, such as scratch force, depth, and specific energy for each representative scratch direction on the c-plane of sapphire, were manifested by the FFM, and the results of the specific scratch energy showed a trend of six-fold symmetry on taking lower values than those of the other scratch directions when the scratch directions correspond to the basal slip directions as 0001⟨112¯0⟩. Since this can be due to the effect of most probably basal slip or less probably basal twinning on the c-plane, a molecular dynamics (MD) simulation of zinc, which is one of the hexagonal close-packed (hcp) crystals with similar slip/twining systems, was attempted to clarify the phenomena. The comparison results between the nanoscratch experiment and the MD simulation revealed that both the specific scratch energy and the burr height were minimized when scratched in the direction of the basal slip. Therefore, it was found that both the machining efficiency and the accuracy could be improved by scratching in the direction of the basal slip in the single groove nanoscratch of c-plane sapphire.

Analysis of Nanoscratch Mechanism of C-Plane Sapphire with the Aid of Molecular Dynamics Simulation of Hcp Crystal