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Ni-Pt alloy thin films have been successfully synthesized and characterized; the films were prepared by the supercritical fluid chemical deposition (SFCD) technique from Ni(hfac) 2  · 3H 2 O and Pt(hfac) 2  precursors by hydrogen reduction. The results indicated that the deposition rate of the Ni-Pt alloy thin films decreased with increasing Ni content and gradually increased as the precursor concentration was increased. The film peaks determined by X-ray diffraction shifted to lower diffraction angles with decreasing Ni content. The deposited films were single-phase polycrystalline Ni-Pt solid solution and it exhibited smooth, continuous, and uniform distribution on the substrate for all elemental compositions as determined by scanning electron microscopy and scanning transmission electron microscopy analyses. In the X-ray photoelectron spectroscopy (XPS) analysis, the intensity of the Pt 4f peaks of the films decreased as the Ni content increased, and vice versa for the Ni 2p peak intensities. Furthermore, based on the depth profiles determined by XPS, there was no evidence of atomic diffusion between Pt and Ni, which indicated alloy formation in the film. Therefore, Ni-Pt alloy films deposited by the SFCD technique can be used as a suitable model for catalytic reactions due to their high activity and good stability for various reactions.

Synthesis and Characterization of Ni-Pt Alloy Thin Films Prepared by Supercritical Fluid Chemical Deposition Technique