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This paper shows a straightforward method for printing multilayer composite capacitors with three dielectric layers on flexible substrates. As known from multilayer ceramic chip capacitors (MLCCs), it is possible to create a parallel connection of the layers without enlarging the needed area. Hence, the overall capacitance is increased, as the capacitances of the single dielectric layers add up. To realize printed capacitors, a special ceramic/polymer composite ink is used. The ink consists of surface-modified Ba 0.6 Sr 0.4 TiO 3 (BST), a polymeric crosslinking agent and a thermal initiator, which allows an immediate polymerization of the ink, leading to very homogenous layers. The dielectric behavior of the capacitors is examined for each completed dielectric layer (via impedance spectroscopy) so that the changes with every following layer can be analyzed. It is demonstrated that the concept works, and capacitors with up to 3420 pF were realized (permittivity of ~40). However, it was also shown that the biggest challenge is the printing of the needed silver electrodes. They show a strong coffee stain effect, leading to thicker edge areas, which are difficult to overprint. Only with the help of printed supporting structures was it possible to lower the failure rate when printing thin dielectric layers.

Fabrication of Flexible Multilayer Composite Capacitors Using Inkjet Printing