English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

We proposed a novel Langasite (LGS) bonding method only using high temperature to solve the manufacturing difficulty of the sealed microcavity of pressure sensors. The optimal bonding parameters by comparative experiments were defined as 1350 °C for 3 h. Due to simple experimental conditions, low experimental cost, and be suitable for bonding wafers with various sizes, the method is convenient for popularization and mass-production, thus promoting the development of surface acoustic wave (SAW) devices at high temperatures. Simultaneously, an intact microcavity was observed by scanning electron microscopy, and a tight and void-free bonding interface with a transition layer thickness of 2.2 nm was confirmed via transmission electron microscopy. The results of tensile and leakage experiments indicated that the bonded wafer with the sealed microcavity exhibited a high bonding strength of 4.02 MPa and excellent seal performance. Compared to the original wafer, the piezoelectric constant of the LGS bonded wafer had a reduction of only 4.43%. The above characteristics show that the sealed microcavity prepared by this method satisfies the conditions for fabricating the LGS SAW pressure sensors. Additionally, based on the bonding interface characterizations, the mechanism of LGS bonding has been investigated for the first time.

Langasite Bonding via High Temperature for Fabricating Sealed Microcavity of Pressure Sensors