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The purpose of this study was to investigate the effects of the microstructure and properties of Cu/Ni multilayer films prepared by magnetron sputtering and electroplating on the electrical explosion performance of the films. In this study, Cu/Ni multilayer films of the same thickness were prepared by electroplating (EP) and magnetron sputtering (MS), and their morphology and crystal structure were characterized by scanning electron microscope (SEM) and transmission electron microscope (TEM). XRD was used to observe the crystal structure and size of the samples. In addition, the Cu/Ni multilayer film was etched into the shape of a bridge, and the electric explosion phenomenon in the same discharge circuit of the multilayer foil obtained by the two preparation processes was tested by an electric explosion performance test system. The resistance-time curve and the energy-resistance curve during the electric explosion process were analyzed and calculated. The results showed that compared with the multilayer film prepared by the MS method, the crystal size of the multilayer film prepared by the EP method is smaller and the interface of Cu/Ni is clearer. In the electric explosion experiment, the MS samples had earlier burst times, larger peak resistances, smaller peak energies and higher ionization voltages. Through observation of the morphology of the samples after the electric explosion and combination with gas ionization theory, the internal influencing factors of the peak voltage and the relative resistance of the two samples were analyzed. The influence of the multilayer film mixing layer thickness on the sample energy conversion efficiency was analyzed by modeling the microstructure of the multilayer film exploding foil and electric heating. The results show that the thicker the mixing layer is, the more energy is distributed on the Ni, the faster the resistance increases, and the higher the energy conversion efficiency.

Study on Electrical Explosion Properties of Cu/Ni Multilayer Exploding Foil Prepared by Magnetron Sputtering and Electroplating