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Dynamic recrystallization (DRX) takes place when FeMnSiCrNi shape memory alloy (SMA) is subjected to compression deformation at high temperatures. Cellular automaton (CA) simulation was used for revealing the DRX mechanism of FeMnSiCrNi SMA by predicting microstructures, grain size, flow stress, and dislocation density. The DRX of FeMnSiCrNi SMA has a characteristic of repeated nucleation and finite growth. The size of recrystallized grains increases with increasing deformation temperatures, but it decreases with increasing strain rates. The increase of deformation temperature leads to the decrease of the flow stress, whereas the increase in strain rate results in the increase of the flow stress. The dislocation density exhibits the same situation as the flow stress. The simulated results were supported by the experimental ones very well. Dislocation density is a crucial factor during DRX of FeMnSiCrNi SMA. It affects not only the nucleation but also the growth of the recrystallized grains. Occurrence of DRX depends on a critical dislocation density. The difference between the dislocation densities of the recrystallized and original grains becomes the driving force for the growth of the recrystallized grains, which lays a solid foundation for the recrystallized grains growing repeatedly.

Investigation of the Dynamic Recrystallization of FeMnSiCrNi Shape Memory Alloy under Hot Compression Based on Cellular Automaton