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Al/Cu dissimilar joining is a key technology for reducing the weight and cost of electrical components. In this study, the dissimilar friction stir lap welding (FSLW) of a Ni-containing Al alloy to pure Cu was performed, and the effects of the addition of Ni on the weld strength and interfacial microstructure were examined. A thin intermetallic compound (IMC) layer was observed at the Al/Cu weld interface produced by FSLW. The addition of 3 at.% Ni effectively improved the weld strength, although the thickness of the IMC layer increased. The IMC layer formed at the Al/Cu interface without Ni comprised CuAl2 and Cu9Al4 from the pure Al side. In contrast, the IMC layer formed with 3 at.% Ni consisted of (Ni,Cu)Al, CuAl, and Cu9Al4 from the Al side. The addition of Ni eliminated the weak CuAl2/Cu9Al4 interface, thereby improving the weld strength. The results of this study suggest that the strength of the Al/Cu weld can be effectively improved by the thinning of the IMC layer caused by FSLW and the change in interfacial microstructure caused by Ni addition.

Effect of Ni Addition on the Interfacial Strength of Al/Cu Dissimilar Welds Produced by Friction Stir Lap Welding