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Polymer bonded magnets based on thermoplastics are economically produced by the injection molding process for applications in sensor and drive technology. Especially the lack of orientation in the edge layer, as well as the chemical resistance and the creep behavior limit the possible implementations of thermoplastic based polymer bonded magnets. However, thermoset based polymer bonded magnets have the opportunity to expand the applications by complying with the demands of the chemical industry or pump systems through to improved chemical and thermal resistance, viscosity and creep behavior of thermosets. This paper investigates the influence of hard magnetic particles on the flow and curing behavior of highly filled thermoset compounds based on an epoxy resin. The basic understanding of the behavior of those highly filled hard magnetic thermoset systems is essential for the fabrication of polymer bonded magnets based on thermosets in the injection molding process. It is shown that several factors like the crystal structure, the particle shape and size, as well as the thermal conductivity and the adherence between filler and matrix influence the flow and curing behavior of highly filled thermoset compounds based on epoxy resin. However, these influencing factors can be applied to any filler system with respect to a high filler amount in a thermoset compound, as they are based on the material behavior of particles. Further, the impact of the flow and curing behavior on the magnetic properties of polymer bonded magnets based on thermosets is shown. With that, the correlation between material based factors and magnetic properties within thermosets are portrayed.

Correlation between the Flow and Curing Behavior of Hard Magnetic Fillers in Thermosets and the Magnetic Properties