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Smart textiles have attracted huge attention due to their potential applications for ease of life. Recently, smart textiles have been produced by means of incorporation of electronic components onto/into conductive metallic yarns. The development, characterizations, and electro-mechanical testing of surface mounted electronic device (SMD) integrated E-yarns is still limited. There is a vulnerability to short circuits as non-filament conductive yarns have protruding fibers. It is important to determine the best construction method and study the factors that influence the textile properties of the base yarn. This paper investigated the effects of different external factors, namely, strain, solder pad size, temperature, abrasion, and washing on the electrical resistance of SMD integrated silver-coated Vectran (SCV) yarn. For this, a Vectran E-yarn was fabricated by integrating the SMD resistor into a SCV yarn by applying a vapor phase reflow soldering method. The results showed that the conductive gauge length, strain, overlap solder pad size, temperature, abrasion, and washing had a significant effect on the electrical resistance property of the SCV E-yarn. In addition, based on the experiment, the E-yarn made from SCV conductive thread and 68 Ω SMD resistor had the maximum electrical resistance and power of 72.16 Ω and 0.29 W per 0.31 m length. Therefore, the structure of this E-yarn is also expected to bring great benefits to manufacturing wearable conductive tracks and sensors.

Study the Electrical Properties of Surface Mount Device Integrated Silver Coated Vectran Yarn