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Spring contact probes (SCPs) are used to make contact with various test points on printed circuit boards (PCBs), wire harnesses, and connectors. Moreover, they can consist of the test interface between the PCBs and the semiconductor devices. For mass production of SCPs, ultra-small precision components have been manufactured by conventional cutting methods. However, these cutting methods adversely affect the performance of components due to tool wear and extreme shear stress at the contact point. To solve this problem, laser spot cutting is applied to Au-coated SCP specimens as an alternative technique. A 20 W nano-second pulsed Ytterbium fiber laser is used, and the experimental variables are different laser parameters including the pulse duration and repetition rate. After the spot cutting experiments, the heat-affected zone (HAZ) and material removal zone (MRZ) formed by different total irradiated energy ( E total  ) was observed by using a scanning electron microscope (SEM). Then, the size of HAZ, top and bottom parts of MRZ, and roundness were measured. Furthermore, the change rate of HAZ and MRZ on Au-coated and non-coated specimens was analyzed with regard to different pulse durations. Based on these results, the effect of Au-coating on the SCP was evaluated through the comparison with the non-coated specimen. Consequently, in the Au-coated specimen, hole penetration was observed at a low pulse duration and low total energy due to the higher thermal conductivity of Au. From this study, the applicability of laser spot cutting to Au-coated SCP is investigated.

Effect of Au-Coating on the Laser Spot Cutting on Spring Contact Probe (SCP) for Semi-Conductor Inspection