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The effect of recrystallization of 99.3Sn-0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 °C for 72 h, which caused the recrystallization of the alloy. The samples were stored at -10 and -20 °C. The β-Sn to α-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the β-Sn to α-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of β-Sn to α-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb