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In this study, effects of sintering temperature and TiH 2 on the sintering process of Cu are investigated. During sintering, the oxide in Cu decomposes and generates oxygen, which can become trapped in the material forming closed pores. Therefore, this results in low sintered density. Sintering behavior of Cu can be significantly improved by adding 0.5 wt.% TiH 2 which decomposes during sintering, producing hydrogen and effectively reducing the oxide in Cu. Although gas products of the reduction reaction may still be trapped inside the close pores formed near the TiH 2 particles and handicap the sintering of Cu, an isothermal treatment at 650 °C can avoid forming close pores. This allows reaction products to dissipate freely from the sample, subsequently increasing its sintered density.

The Effects of Sintering Temperature and Addition of TiH2 on the Sintering Process of Cu