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In optical fabrication, brittle-hard materials are used for numerous applications. Especially for high-performance optics for laser or lithography applications, a complex and consistent production chain is necessary to account for the material properties. Particularly in pre-processing, e.g., for shaping optical components, brittle material behavior is dominant which leads to a rough surface layer with cracks that reach far below the surface. This so called subsurface damage (SSD) needs to be removed in subsequent processes like polishing. Therefore, it is essential to know the extent of the SSD induced by shaping for an efficient design of precise corrective processes and for process improvement. Within this work the influence of cutting speed on SSD, in fused silica, induced by grinding has been investigated. To analyze the subsurface crack distribution and the maximum crack depth magnetorheological finishing has been appointed to polish a wedge into the ground surface. The depth profile of SSD was analyzed by image processing. For this purpose a coherent area of the polished wedge has been recorded by stitching microscopy. Taking the form deviation of the ground surface in to account to determine the actual depth beneath surface, the accuracy of the SSD-evaluation could be improved significantly. The experiments reveal a clear influence of the cutting speed on SSD, higher cutting speeds generate less SSD. Besides the influence on the maximum crack depth an influence on the crack length itself could be verified. Based on image analysis it was possible, to predict the maximum depth of cracks by means of crack length

Influence of Cutting Speed on Subsurface Damage Morphology and Distribution in Ground Fused Silica