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Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor E is introduced to evaluate the comprehensive heat transfer performance of microchannel heat sinks (MCHS). The computational fluid dynamics (CFD) software was used to numerically study the fluid flow and heat transfer characteristics in the cone-column combined heat sink. The research results obtained the velocity field and pressure field distribution of the heat sink structure in the range of 100 ≤ Re ≤ 700. When Re changes, the change law of pressure drop ΔP, friction factor f, average Nussel number Nuave, average substrate temperature T, and enhanced heat transfer factor E, are compared with the circular MCHS. The results show that the uniform arrangement of the cones inside the cone-column combined heat sink can change the flow state of the cooling medium in the microchannel and enhance the heat transfer. In the range of 100 ≤ Re ≤ 700, the base temperature of the cone-column combined heat sink is always lower than the base temperature of the circular MCHS, and the average Nusselt number Nuave is as high as 2.13 times that of the circular microchannel. The enhanced heat factor E is 1.75 times that of the circular MCHS, indicating that the comprehensive heat transfer performance of the cone-column combined heat sink is significantly better than that of the circular microchannel.

Numerical Study of Fluid Flow and Heat Transfer Characteristics in a Cone-Column Combined Heat Sink