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In this study, (Al 0.5 CrFeNiTi 0.25 )N x high-entropy films are prepared by a reactive direct current (DC) magnetron sputtering at different N 2 flow rates on silicon wafers. It is found that the structure of (Al 0.5 CrFeNiTi 0.25 )N x high-entropy films is amorphous, with x = 0. It transforms from amorphous to a face-centered-cubic (FCC) structure with the increase of nitrogen content, while the bulk Al 0.5 CrFeNiTi 0.25 counterpart prepared by casting features a body-centered-cubic (BCC) phase structure. The phase formation can be explained by the atomic size difference (δ). Lacking nitrogen, δ is approximately 6.4% for the five metal elements, which is relatively large and might form a BCC or ordered-BCC structure, while the metallic elements in this alloy system all have a trend to form nitrides like TiN, CrN, AlN, and FeN. Therefore, nitride components are becoming very similar in size and structure and solve each other easily, thus, an FCC (Al-Cr-Fe-Ni-Ti)N solid solution forms. The calculated value of δ is approximately 23% for this multicomponent nitride solid solution. The (Al 0.5 CrFeNiTi 0.25 )N x films achieve a pronounced hardness and a Young's modulus of 21.45 GPa and 253.8 GPa, respectively, which is obviously much higher than that of the as-cast Al 0.5 CrFeNiTi 0.25 bulk alloys.

Effects of Nitrogen Content on the Structure and Mechanical Properties of (Al0.5CrFeNiTi0.25)Nx High-Entropy Films by Reactive Sputtering