English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

Nanocomposite inks composed of nickel–silver core–shell and silver nanoparticles (NPs) can combine the advantages of lower cost, high conductivity, and low-temperature sintering processes, which have attracted much attention in the development of materials for printed flexible electronics. In this context, in the present paper, we report the process of preparation of nanocomposite ink containing nickel–silver core–shell nanoparticles, as the main filler, and silver nanoparticles, as doping material, and their application for the fabrication of conductive coatings. It was found that the addition of a low concentration of Ag NPs to ink formulation based mainly on low-cost Ni-Ag NPs improves the conductive properties of coatings fabricated by ink deposition on a glass substrate. Two types of prepared nanocomposite ink coatings showed promising properties for future application: (1) doped with 0.5% of Ag NPs sintered at 200 °C as low cost for larger industrial application and, (2) containing 1% of Ag NPs sintered at 150 °C for the fabrication of conductive printed patterns on flexible substrates. The conductivity of such nanocomposite films was similar, about of 6 × 106 S/m, which corresponds to 35% of that for a bulk nickel.

Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering