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The technology of multi-wire sawing is well established in the production of silicon wafers but can also be applied in the production of ceramic substrates. In this study, the influence of the Al2O3-grain size of the alumina ceramic on the efficiency of the multi-wire slurry process was investigated. The grain size of HIPed alumina ceramics was changed by heat treatment processes at 1350 °C and 1400 °C. A B4C slurry was used for the investigation of the cutting of high purity alumina ceramic. With increasing grain size of the ceramic, the efficiency of the sawing process increases. The analysis of the as-cut surface morphology of the substrates shows a change in material removal from trans- to intergranular micro-fracture with increasing grain size. Furthermore, grain coarsening leads to substrates with increased roughness values and reduced biaxial strength.

Grain-Size Effects on Multi-Wire Slurry Sawing of Translucent Alumina Ceramics