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Soy flour was partly substituted for urea-formaldehyde (UF) resin with different content to investigate its effect on formaldehyde emission in three-layer plywood panels. In each square meter of panels, 300 g of resin was used (wet weight basis of resin). Micron-sized wollastonite was added to the resin mixture at 5% and 10% consumption levels (wet weight basis of resin) to determine its potential effects as a reinforcing filler to mitigate the negative effects of addition of soy flour. Results showed a decreasing trend in formaldehyde emission as soy flour content increased to 20%. The highest shear-strength values were observed in panels with 10% and 15% soy flour content. The addition of wollastonite did not have a significant effect on formaldehyde emission, but it decreased the shear strength in soy-treated panels, although the values were still higher than those of control panels. Wollastonite significantly mitigated the negative effects of soy flour on the water absorption and thickness swelling of panels. It was concluded that 10% of soy flour and 5% of wollastonite provided the lowest formaldehyde emission and the most optimum physical and mechanical properties.

Formaldehyde Emission in Micron-Sized Wollastonite-Treated Plywood Bonded with Soy Flour and Urea-Formaldehyde Resin