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In this study, we studied the surface and mechanical properties of multiple additives as well as the initial plating properties of individual additives. With the individual additive groups, copper crystals tended to converge at a stage above the critical amount of additive. When chloride ions were added, large crystals formed at several places on the surface. Thereafter, small crystals were attached to and grew on the surface of the large crystals. When collagen and JGB (Janes Green B) were added individually, the crystals were more uniformly distributed on the surface as compared with the group with added chloride ions. In addition, starlike crystals were grown depending on the amount of addition. It was necessary to use multiple additives, which is why it is difficult to make a uniform surface layer with individual additives. Large crystals of more than 10 μm formed unevenly on the surface treated with multiple additives of chloride ions and MPSA (3-mercapto-1-propane sulfonic acid). Large crystals disappeared on the surface treated with additional collagen along with multiple additives. However, valley like shapes were observed on this surface, due to the large crystals. But, addition of JGB additives to this reduced the valley and formed a uniform plating layer. MPSA and 20 ppm of collagen were added as multiple additives, grain sizes increased by 93.5% (220 peak) and 172.3% (311 peak) compared with the non-additive group. As a result, tensile strength decreased by 24.5% and elongation increased by 17.8%. The crystal size was reduced 25.0% on average by the addition of 10 ppm JGB, which contributed to a 5.4% increase in tensile strength and a 16.0% decrease in elongation. The grain size and surface properties could be controlled by adding multiple combinations of additives. As a result, It was confirmed that mechanical properties could be controlled by the proper amount and the optimum combination of additives. (Received November 3, 2020; Accepted November 18, 2020)

Initial Behavior of Additives and Mechanical Properties of Copper Foils on High Current Density