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Using electroplating to produce copper foil has many economic advantages. In addition, the easiest way to manufacture electroplated copper foil with various properties is to add appropriate additives. This study evaluated the surface properties, mechanical and electrical properties of copper foil electroplated in electrolytes containing the leveler JGB (Janus Green B). When the leveler JGB was added as an additive, Cu crystals were distributed uniformly on the surface layer in an initial nucleation process. In the JGB-free group, dents and pinholes were observed on the surface of the 12 μm thick electroplated Cu foil. Such surface defects were reduced with the addition of JGB. Surface roughness was decreased by 68% in groups electroplated in electrolytes with 10 ~ 40 ppm JGB, versus a JGB-free group. It was observed that the priority growth direction of crystal texture changed from (200), (111) to (220). Elongation decreased by 59%, while the tensile strength increased by 157% due to a decrease in crystal size of 69%. With the addition of 0 ~ 40 ppm JGB, resistivity increased due to the decrease in crystal size and changes in the crystal texture. Based on linear regression approximations between 0 and 40 ppm the value of R was 91.4%. There was no statistically significant difference between 40 and 60 ppm, and the resistivity was 37.7% higher than in the JGB-free group. (Received October 4, 2019; Accepted November 22, 2019)

Changes in Electrical Properties of Copper-Plated Layer by Organic Additives on High Current Density