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The effects of heat treatment and thermal cycle conditions on the bonding strength and interfacial characteristics of electroplated Cr/electroplated Ni-P coatings were systematically evaluated. In step1 samples, heat treatment was performed at 750 oC for 6 hours after successive electroplating of Ni-P and Cr layers. In step2 samples, 1st heat treatment was performed at 500 oC for 3 hours after electroplating Ni-P, and then, 2nd heat treatment was performed at 750 oC for 6 hours after electroplating Cr. The bonding strengths measured by ASTM C633 were around 54.6 MPa before thermal cycling, and decreased to 35 MPa and 29.9 MPa for step1 and step2, respectively, after 1,000 cycles between 150~600 oC. Increasing the number of thermal cycles led to an increasing adhesive/Cr interface delaminated mode, which seemed to be closely related to the decreasing bonding strength possibly due to severe Cr surface oxidation. Also, the higher residual stress in the step1 than step2 samples is thought to be responsible for the higher density of channeling cracks in the Cr layer, which led to slightly stronger bonding strength due to the mechanical interlocking effects of the adhesive inside the channeling cracks. (Received Nobember 7, 2017; Accepted January 12, 2018)

daehan geumsog jae'lyo haghoeji/daehan geumsok jaeryo hakoeji

Effects of Heat Treatment and Thermal Cycle Conditions on the Bonding Strength and Interfacial Characteristics of Electroplated Cr/Electroplated Ni-P Coatings