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A novel bisphenol 1, 4'-bis{4-[(4-hydroxy) phenyliminomethylidene] phenoxy} benzene (BHPB), which contains azomethine moiety and flexible aromatic ether linkage, was synthesized and introduced into the curing system composed of diglycidyl ether of bisphenol A (DGEBA) and diamine. The curing behavior of DGEBA/diamine changed dramatically due to the introduction of BHPB. The resultant epoxy thermosets containing BHPB had high Tgs (127-160 °C), high Td, 5% (>=330°C) and high integral procedure decomposition temperature (IPDT) values (662-1230°C) and good flame retardancy for their high Limited Oxygen Index (LOI) values (above 29.5)

Improvement of thermal properties and flame retardancy of epoxy-amine thermosets by introducing bisphenol containing azomethine moiety