English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

The adoption of 3D packaging technology necessitates the development of newapproaches to failure electronic device analysis. To that end, our team isdeveloping a tool called the quantum diamond microscope (QDM) that leverages anensemble of nitrogen vacancy (NV) centers in diamond, achieving vector magneticimaging with a wide field-of-view and high spatial resolution under ambientconditions. Here, we present the QDM measurement of 2D current distributions inan 8-nm flip chip IC and 3D current distributions in a multi-layer PCB.Magnetic field emanations from the C4 bumps in the flip chip dominate the QDMmeasurements, but these prove to be useful for image registration and can besubtracted to resolve adjacent current traces in the die at the micron scale.Vias in 3D ICs display only Bx and By magnetic fields due to their verticalorientation and are difficult to detect with magnetometers that only measurethe Bz component (orthogonal to the IC surface). Using the multi-layer PCB, weshow that the QDM's ability to simultaneously measure Bx, By, and Bz isadvantageous for resolving magnetic fields from vias as current passes betweenlayers. We also show how spacing between conducting layers is determined bymagnetic field images and how it agrees with the design specifications of thePCB. In our initial efforts to provide further z-depth information for currentsources in complex 3D circuits, we show how magnetic field images of individuallayers can be subtracted from the magnetic field image of the total structure.This allows for isolation of signal layers and can be used to map embeddedcurrent paths via solution of the 2D magnetic inverse. In addition, the paperalso discusses the use of neural networks to identify 2D current distributionsand its potential for analyzing 3D structures.

Vector Magnetic Current Imaging of an 8 nm Process Node Chip and 3D Current Distributions Using the Quantum Diamond Microscope