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The interfacial reaction, change of intermetallic compound (IMC) morphology and shear strength of Sn–0.7 wt.% Cu solder/Ni joints were investigated during reflow at 255 °C for times of up to 20 min. Up to the reaction time of 1 min, a needle-type (Cu,Ni) 6 Sn 5  IMC with a hexagonal cross-section was formed. After reflow for 5 min, the (Ni,Cu) 3 Sn 4 IMC started to form under the (Cu,Ni) 6 Sn 5  IMC. After prolonged reflow time, the upper (Cu,Ni) 6 Sn 5  IMCs detached from the interface. Also, the morphology of the (Cu,Ni) 6 Sn 5  IMC changed from needle type to dodecagonal type with increasing reflow time. In the ball shear test, the shear strength did not change significantly as a function of the reflow time. The result of the shear test indicated that the shear strength of the Sn– 0.7Cu/Ni ball-grid array solder joint was not significantly related to the thickness and spalling phenomenon of the IMCs formed at the interface.

Interfacial reaction and shear strength of Sn–0.7Cu solder/electrolytic Ni joints with reflow time