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Ti 2 SnC dispersion-strengthened (DS) copper matrix composites were prepared by the hot-pressing method. The change of microstructure, mechanical properties, and electrical resistivity of the composites as a function of Ti 2 SnC volume fraction were studied. The results demonstrated that the grain size of Cu decreased pronouncedly by incorporating Ti 2 SnC, and the strengthening effect was significant. Improvements in yield strength of up to four times that of pure copper were found in Cu-1 vol.% Ti 2 SnC, however, the conductivity of the composite was still 85.6% of pure copper. The high strength and low electrical resistivity indicated that Ti 2 SnC is a promising reinforcement for copper.

Mechanical and electrical properties of Ti 2 SnC dispersion-strengthened copper