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The hot-deformation behavior of oxygen-free high-conductivity (OFHC) copper has been studied in the temperature range 300–950 °C and strain rate range 0.001–100 s  –1  using hot-compression tests. The dynamics of the behavior is studied with the help of processing maps, and the-rate controlling processes are evaluated using the standard kinetic rate equation. The processing maps exhibited two domains: (1) in the temperature range 600–900 °C and strain rate range 0.01–10 s –1 , (2) in the range 750–950 °C and 30–100 s  –1 . From kinetic analysis of the flow stress data, apparent activation energy values of 159 kJ/mole and 75 kJ/mole have been estimated in the above two domains, respectively. These values suggest that dislocation core self-diffusion and grain boundary self-diffusion are the rate-controlling mechanisms. In both these domains, the average grain diameter varies linearly with the Zener–Hollomon parameter.

Kinetics and dynamics of hot deformation of OFHC copper in extended temperature and strain rate ranges